Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated.\nTwo differential compensation structures for various lengths of interconnects are designed and experimentally evaluated\nusing dedicated transmit and receive radar modules operating across a 110ââ?¬â??156 GHz band. Measurement results\ndemonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential\ninterconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended\nchip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than\n1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive\nsolution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.
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